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package lead

См. также в других словарях:

  • package lead — korpuso išvadas statusas T sritis radioelektronika atitikmenys: angl. package lead vok. Gehäuseanschluß, m rus. вывод корпуса, m pranc. sortie de boîtier, f …   Radioelektronikos terminų žodynas

  • Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips …   Wikipedia

  • Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads …   Wikipedia

  • Quad Flat No Leads Package — QFN Gehäuse von unten. Am Rand die Anschlusspins, in der Mitte eine Massefläche …   Deutsch Wikipedia

  • Multi-leaded power package — An example of a 9 lead multi leaded power package The multi leaded power package is a style of electronic component package, commonly used for high power integrated circuits, especially for monolithic audio amplifiers. It was derived from single… …   Wikipedia

  • RPM Package Manager — (RPM) Original author(s) Red Hat Developer(s) Community[1] Stable release 4.9.0 / March 2, 2011; 8 months ago ( …   Wikipedia

  • Nix package manager — Platform Linux, Unix like License LGPL Website http://nixos.org …   Wikipedia

  • Shrink Small-Outline Package — (SSOP) is a microchip package for surface mount technology. SSOP chips have gull wing leads protruding from the two long sides, and a lead spacing of 0.025 inches (0.635mm).ee also*Plastic Small Outline Package (PSOP) *Thin Small Outline Package… …   Wikipedia

  • A Big Package for You — Infobox Album Name = A Big Package for You Type = Live Longtype = including CD Artist = Simple Plan Released = November 25, 2003 Length = Genre = Rock Label = Lava Producer = | A Big Package for You: 1999 2003 is a DVD/CD by the pop punk band… …   Wikipedia

  • high lead-count package — korpusas su daugeliu išvadų statusas T sritis radioelektronika atitikmenys: angl. high lead count package; multipin package vok. Gehäuse mit hoher Anschlußzahl, n; mehrpoliges Gehäuse, n rus. корпус с большим числом выводов, m; многоштырьковый… …   Radioelektronikos terminų žodynas

  • Thin small-outline package — Thin small outline packages, or TSOPs are a type of surface mount IC package. They are notably very low profile (about 1mm) and have tight lead spacing (as low as 0.5mm).They are frequently used for RAM or Flash memory ICs dues to their high pin… …   Wikipedia

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